Advanced Packaging
Advanced Packaging Burn-in Test, Inspection & Sorting Solutions
Our next-generation innovations in Advanced Packaging – breakthrough solutions designed to meet tomorrow’s challenges and drive the future of AI
advanced semiconductor technology.
Wafer-Level
2D+ 3D Wafer AOI SiPH Probing & Test 3D X -Ray Inspection
Die-Level
Chiplet & Die Test
Panel-Level
Panel validation
System-Level
HPC Burn -in ATC System -Level Test
Our Solutions
Our portfolio addresses every stage of the advanced packaging process — from wafer inspection and functional testing to high-precision sorting and burn-in.
2D + 3D Wafer Inspection
Silicon Photonics (SiPH) Wafer Probing
Silicon Photonics (SiPH) Test
Chiplet & Die Test
Panel/ Board/ Substrate IVR Testing
Active Thermal Control System-Level Testing
X-RAY 3D Inspection
HPC Burn-in