Advanced Packaging
Advanced Packaging Burn-in Test, Inspection & Sorting Solutions
Our next-generation innovations in Advanced Packaging – breakthrough solutions designed to meet tomorrow’s challenges and drive the future of AI
advanced semiconductor technology.
Wafer-Level
2D+ 3D Wafer AOI
SiPh Probing & Test
3D X-Ray Inspection
Die-Level
Die-Level & Chiplet Prober
System-Level
HPC Burn-in
ATC System-Level Test
Panel-Level
Substrate and Panel Level Testing
Our Solutions
Our portfolio addresses every stage of the advanced packaging process — from wafer inspection and functional testing to high-precision sorting and burn-in.
2D + 3D Wafer Inspection
Silicon Photonics (SiPh) Wafer Probing
Silicon Photonics (SiPh) Test
Die-Level & Chiplet Prober
Substrate and Panel Level Testing
Active Thermal Control System-Level Testing
X-RAY 3D Inspection
HPC Burn-in