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Lineare Pick & Place-Test & -Bildverarbeitung

Our Linear Pick & Place Test & Vision Handlers integrate direct docking with a streamlined linear mechanism, delivering precision and efficiency across development, low-volume, and high-volume production.
Mason

Lineares Pick & Place-System

Ein leistungsstarkes Pick & Place-System, entwickelt für Hochvolumen-Multi-Site-Tests von ICs und Bildsensoren, unterstützt Einzel-, Dual-, Quad- und Oktal-Testplätze.

JEDEC-Tray
QFP, BGA, QFN, MLF, TSSOP, SOIC, SIP, ODFN, OLGA
Elektrischer Funktionstest, CMOS-Bildsensor-Test, Test bei Raum- bis Hochtemperatur
Bis zu 16 Testplätze
AERO-10

Device Characterization System

It is a space efficient and versatile test system for power semiconductors, MEMS and optical devices - from development to low-volume production.

JEDEC Tray, Automated Tray Stacker, Waffle Pack, Wafer Ring, Plastic/Metal Tube, Vibrator Bowl Feeder
JEDEC Tray, Automated Tray Stacker, Waffle Pack, Wafer Ring, Plastic/Metal Tube, Tape & Reel
SOP, SOJ, SON, QFP, QFJ, QFN, LGA, BGA, WLCSP, bare die
(Can be configured to all packages within size limitations)
ICs, Optical devices, Sensors, Power Devices
(Standard and customized test stations available)
Stimulus Options
  • Environmental chambers for gas, humidity and pressure sensor test
  • Dual-axis motion setup for inertial sensor test
  • Magnetic field stimulus for magnetometer and hall effect
  • Ambient light sensors test units (dark, angle, sensitivity, linearity, gain, spectral response)
High Power Test
  • KGD and discrete Final Test
Standard: Single Site (Multi-site per request)
  • Direct Dock from bottom
  • Direct Dock with cable connection
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