Advanced Packaging

Advanced Packaging Burn-in Test, Inspection & Sorting Solutions

Our next-generation innovations in Advanced Packaging – breakthrough solutions designed to meet tomorrow’s challenges and drive the future of AI advanced semiconductor technology.

Our Solutions

Our portfolio addresses every stage of the advanced packaging process — from wafer inspection and functional testing to high-precision sorting and burn-in.

ZANX Series

2D + 3D Wafer Inspection

Macro & Micro 2D + 3D surface inspection
Detection sensitivity down to 0.5um
Bright Field (BF) / Dark Field (DF) optical metrology
Auto-focus with multi-magnification

LUMON Series

Silicon Photonics (SiPh) Wafer Probing

Single & dual-sided wafer probing
Multi-mode test support (E/O, O/E, O/O, E/E)
Sub-micron optical alignment
Low-loss measurement alignment

SINAR

X-Ray 3D Inspection

3D computed laminography & 2D X-Ray
High speed imaging with 100nm resolution
AI-Powered Advanced Metrology
TSV, TGV, micro-bump and RDL inspection

AERO-20

Chiplet & Die Testing

High pin count support for large SoC and HPC dies
Hard-docking & optical stack integration
Tri-tempertaure with Active Thermal Control
Micron-level pin-to-pad alignment

BAYAN

Substrate and Panel Level Testing

Double side parallel probing
>40k pin count (top and bottom)
Supports IVR, LCR and JTAG tests
Micron level alignment

PINTAR

HPC Burn In

More than 2000W device / 8000W per BIB slot
16 burn-in-board (BIB) slots
Active Thermal Control liquid cooling
Up to 256 vector I/O

MASON

ATC System-Level Test

6 or 12 parallel test sides
Closed-loop Active Thermal Control
300kgf contacr force
Broad testing conditions: -40 to 150

Advanced Packaging Burn-in Test, Inspection & Sorting Solutions

Wafer-Level

Die-Level

Panel-Level

System-Level