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Wafer-Level Inspection

ZAN-X 2000

Advanced Wafer AOI System
ZANX 2000 is an advanced automated wafer inspection system engineered for high-resolution detection of both micro and macro surface defects on Bare Wafers and Film Frame Wafers.

Bare wafer (6", 8", 12")
Wafer Thickness: 100um~1000um
Film frame wafer (6", 8", 12")
FOUP/FOSB, Open Cassette, Metal Cassette
Micro Inspection Macro Inspection
Camera
High resolution color camera		 Camera
Area Scan Colour camera
Objective lens
1X, 2X, 3X, 5X, 7.5X, 10X, 20X, 50X		 Min defect detection
240um
Min defect detection
0.5um		 Illumination
BF/DF
AI defect classification
Detect patterns, defect labeling and sorting 		Image processing algorithm
Image masking
Illumination
BF/DF
GR&R
0.5 pix
Accuracy
2 pix
Autofocus
Auto lens exchange
Differential Interference Contrast (DIC) mode
Photoluminescence (PL) inspection
Image processing algorithm
Image masking
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