Skip to content
No results
About
Our Solutions
Discrete & Integrated Circuits
Test Solutions
Turret Test & Vision
Gravity Feed Test & Vision
Linear Pick & Place Test & Vision
Automated Vision Inspection
Turret Base Vision Inspection
Glass Turret Base Vision Inspection
Reel to Reel Vision Inspection
Paper Tape to Tape Vision Inspection
Die & Wire Bond Vision Inspection
Strip to Strip Vision Inspection
Post Dicing Vision Inspection
Laser Marking & Cutting/Deburring Process
Laser Marking
Laser Cutting & Deburr
Electro-Optical/MEMS Sensors
Active Alignment Assembly
AA Collimator Assembly
AA DOE Assembly
AA Projector Assembly
AA Lens
Test Solutions
Wafer-Level Test
Module-Level Test
Burn-in Solutions
Wafer/Module-Level Burn-in
SiC | GaN | Power Modules
Automated Assembly Solutions
Laser Marking/Welding
DBC/AMB Substrate-Level Segregation
DBC/AMB Substrate-Level Placement
Epoxy Dispense & Case Attach
Ultrasonic Welding Handler
Pin Insertion
Plastic Housing Auto Replacement
Lead Frame Attach
Trim & Form
Automated Optical Inspection Solutions
Wafer-Level Inspection
Final Inspection
Burn-in Solutions
Wafer-Level Burn-in
Module-Level Burn-in
Test Solutions
Wafer-Level Test
Die-Level Test
DBC/AMB Substrate-Level Test
Discrete-Level Test
Module-Level Final Test
Factory Automation
Factory Automation Solutions
intelligent-Automated Robotics Manufacturing System (i-ARMS)
Our Market Sectors
Food & Beverage
Automotive
Meditech Manufacturing
Industrial & Consumer Products
Semiconductor
Renewable Energy
Poultry Farm
Warehouse Automation
Warehouse Automation Solutions
SCOOT-CAR Automated Pallet Storage Retrieval System
Mini Stocker ASRS System
High Speed Sortation System
Auto Storage Dry Cabinet System
Machine & Product Contract Manufacturing
Career
News
Media News
News Release
Upcoming Events
Activities
Investor Relations
PCB
Investor Relations
IR Homepage
Financial Results
Financial Ratios
Financial Calendar
Annual Reports
Announcements
Annual General Meeting
Stock Information
Interactive Charts
Stock Fundamental
Investment Calculator
Corporate Governance
Audit Committee
Nominating Committee
Remuneration Committee
Board Charter
Director’s Fit and Proper Policy
Code of Conducts
Whistle-blowing Policy and Procedures
Anti-Corruption and Bribery Policy
Information Request
Email Alerts
Downloads Library
IR Contact
PIL (EN)
Investor Relations
IR Homepage
Financial Results
Financial Ratios
Financial Reports
Announcements
Circulars & Shareholders’ Meetings
Dissemination of Corporate Communications
Corporate Governance
Audit Committee
Nomination Committee
Remuneration Committee
Board Charter
Code of Ethics
Memorandum and Articles of Association
Procedures for Shareholders to Propose a Director
Dividend Policy
Whistle-blowing Policy and Procedures
Anti-Corruption and Bribery Policy
Others
Analysts Coverage
Investor Presentation
Information Request
PIL (CN)
投資者關係
投資者關係主頁
業績報告
財務比率
財務報告
公告
通函及股东会
發佈企業通訊
企業管治
審核委員會
提名委員會
薪酬委員會
董事會章程
道德規範
組織章程大綱及細則
股東提名董事的程序
股息政策
舉報政策和程序
反貪污和賄賂政策
其他
分析師覆蓋面
投資者簡報
投資諮詢
Contact
About
Our Solutions
Discrete & Integrated Circuits
Test Solutions
Turret Test & Vision
Gravity Feed Test & Vision
Linear Pick & Place Test & Vision
Automated Vision Inspection
Turret Base Vision Inspection
Glass Turret Base Vision Inspection
Reel to Reel Vision Inspection
Paper Tape to Tape Vision Inspection
Die & Wire Bond Vision Inspection
Strip to Strip Vision Inspection
Post Dicing Vision Inspection
Laser Marking & Cutting/Deburring Process
Laser Marking
Laser Cutting & Deburr
Electro-Optical/MEMS Sensors
Active Alignment Assembly
AA Collimator Assembly
AA DOE Assembly
AA Projector Assembly
AA Lens
Test Solutions
Wafer-Level Test
Module-Level Test
Burn-in Solutions
Wafer/Module-Level Burn-in
SiC | GaN | Power Modules
Automated Assembly Solutions
Laser Marking/Welding
DBC/AMB Substrate-Level Segregation
DBC/AMB Substrate-Level Placement
Epoxy Dispense & Case Attach
Ultrasonic Welding Handler
Pin Insertion
Plastic Housing Auto Replacement
Lead Frame Attach
Trim & Form
Automated Optical Inspection Solutions
Wafer-Level Inspection
Final Inspection
Burn-in Solutions
Wafer-Level Burn-in
Module-Level Burn-in
Test Solutions
Wafer-Level Test
Die-Level Test
DBC/AMB Substrate-Level Test
Discrete-Level Test
Module-Level Final Test
Factory Automation
Factory Automation Solutions
intelligent-Automated Robotics Manufacturing System (i-ARMS)
Our Market Sectors
Food & Beverage
Automotive
Meditech Manufacturing
Industrial & Consumer Products
Semiconductor
Renewable Energy
Poultry Farm
Warehouse Automation
Warehouse Automation Solutions
SCOOT-CAR Automated Pallet Storage Retrieval System
Mini Stocker ASRS System
High Speed Sortation System
Auto Storage Dry Cabinet System
Machine & Product Contract Manufacturing
Career
News
Media News
News Release
Upcoming Events
Activities
Investor Relations
PCB
Investor Relations
IR Homepage
Financial Results
Financial Ratios
Financial Calendar
Annual Reports
Announcements
Annual General Meeting
Stock Information
Interactive Charts
Stock Fundamental
Investment Calculator
Corporate Governance
Audit Committee
Nominating Committee
Remuneration Committee
Board Charter
Director’s Fit and Proper Policy
Code of Conducts
Whistle-blowing Policy and Procedures
Anti-Corruption and Bribery Policy
Information Request
Email Alerts
Downloads Library
IR Contact
PIL (EN)
Investor Relations
IR Homepage
Financial Results
Financial Ratios
Financial Reports
Announcements
Circulars & Shareholders’ Meetings
Dissemination of Corporate Communications
Corporate Governance
Audit Committee
Nomination Committee
Remuneration Committee
Board Charter
Code of Ethics
Memorandum and Articles of Association
Procedures for Shareholders to Propose a Director
Dividend Policy
Whistle-blowing Policy and Procedures
Anti-Corruption and Bribery Policy
Others
Analysts Coverage
Investor Presentation
Information Request
PIL (CN)
投資者關係
投資者關係主頁
業績報告
財務比率
財務報告
公告
通函及股东会
發佈企業通訊
企業管治
審核委員會
提名委員會
薪酬委員會
董事會章程
道德規範
組織章程大綱及細則
股東提名董事的程序
股息政策
舉報政策和程序
反貪污和賄賂政策
其他
分析師覆蓋面
投資者簡報
投資諮詢
Contact
Search
Menu
Awards Recognition
March 11, 2023
Pathfinder Award 2023
Home
awarded by – Dexcom US
