Penang, Malaysia (April 2025) – Pentamaster, a global leader in automation solutions, is expanding its expertise into the advanced packaging industry to drive AI innovation and support the evolving semiconductor landscape. As the demand for high-performance computing, AI, cloud computing, and electric vehicles (EVs) continues to rise, advanced packaging has become a critical enabler of next-generation electronics. These technologies require increasingly complex interconnects, higher integration densities, and improved thermal performance, making precise inspection and testing essential to ensure product reliability and efficiency.
To address these challenges, Pentamaster has developed state-of-the-art inspection, testing, and burn-in solutions tailored for advanced packaging manufacturing. The ZanX-1000/2000 vision inspection system plays a pivotal role in ensuring product reliability, yield optimization, and defect detection at the micro-level while supporting high-volume automation. It effectively identifies defects such as misalignment, cracks, and warpage, helping manufacturers maintain performance consistency for AI, HPC, and 5G applications.
Our advanced packaging test solutions seamlessly integrate with existing semiconductor production lines, supporting key technologies such as fan-out wafer-level packaging (FOWLP), flip-chip, 2.5D/3D ICs, and chiplet integration. With the increasing complexity of semiconductor devices, precise electrical testing is crucial. Our systems provide open-short testing, functional verification (e.g., RDson), and inductor testing with JTAG support to ensure electrical integrity and performance consistency. Scalable and highly adaptable, these solutions enhance efficiency while reducing manual intervention, improving throughput, and maintaining high product yields.
Pentamaster remains committed to accelerating the adoption of advanced packaging through innovative, high-performance test and inspection solutions. By providing manufacturers with cutting-edge automation technology, we enable them to enhance product quality, maximize yield, and drive the next generation of semiconductor advancements, reinforcing our position as a trusted industry partner.
Contact us to know more.